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ACMD-7403 miniature umts band ii / pcs duplexer data sheet description the avago technologies ACMD-7403 is a miniature duplexer designed for use in umts band ii and pcs (blocks aCf) handsets. the ACMD-7403 enhances the sensitivity and dynamic range of handset receivers by providing more than 54 db attenuation of the transmitted signal at the receiver input and more than 44 db rejection of transmit-generated noise in the receive band. maximum insertion loss in the tx channel is only 2.7 db, which minimizes current drain from the power amplifer. insertion loss in the rx channel is a maximum of 3.2 db, thus improving receiver sensitivity. the ACMD-7403 is designed with avago technologies film bulk acoustic resonator (fbar) technology, which makes possible ultra-small, high-q flters at a fraction of their usual size. the excellent power handling capa - bility of the fbar bulk-mode resonators supports the high output power levels needed in pcs handsets while adding virtually no distortion. the ACMD-7403 also utilizes avago technologies innova - tive microcap bonded-wafer, chip scale packaging tech - nology. this process allows the flters to be assembled in a molded chip-on-board module that is less than 1.2 mm high with a footprint of only 3.0 mm x 3.0 mm. features ? miniature size ? 3.0 x 3.0 mm max footprint ? 1.2 mm max height ? high power rating ? 33 dbm abs max tx power ? lead-free construction specifcations ? rx band performance, 1930.5-1989.5 mhz, C 30 to +85c ? rx noise blocking: 44 db min ? insertion loss: 3.2 db max ? tx band performance, 1850.5-1909.5 mhz, C 30 to +85c ? tx interferer blocking: 52 db min ? insertion loss: 2.7 db max applications handsets or data terminals operating in the pcs (aCf) frequency band. functional block diagram
ACMD-7403 electrical specifcations [2,3] , z 0 =50 ? , t c [1] as indicated, symbol parameter units C 30 c +25 c +85 c min typ max min typ max min typ max antenna port to receive port s23 insertion loss in receive band 1930.5 C 1931.5 mhz 1931.5 C 1989.5 mhz db 3.2 3.0 1.9 1.3 3.1 3.0 3.0 3.2 fs23 ripple (p-p) in receive band db 1.7 s22 return loss of receive port in receive band db 9.5 9.5 15 9.5 s23 attenuation in transmit band (1850.5 C 1909.5 mhz) db 52 52 59 52 s23 attenuation 0 C 1600 mhz db 20 29 s23 attenuation in receive 2nd harmonic band (3861 C 3979 mhz) db 14 18 transmit port to antenna port s31 insertion loss in transmit band 1850.5 C 1908.5 mhz 1908.5 C 1909.5 mhz db 2.5 2.5 1.0 1.4 2.1 2.3 2.5 2.7 fs31 ripple (p-p) in transmit band db 1.3 s11 return loss of transmit port in transmit band db 9.5 9.5 20 9.5 s31 attenuation in receive band (1930.5 C 1989.5 mhz) db 40 40 49 40 s31 attenuation 0 C 1600 mhz db 22 32 s31 attenuation in gps rx band (1574.42 C 1576.42 mhz) db 23 27 s31 attenuation in transmit 2nd harmonic band (3701 C 3819 mhz) db 5 9 antenna port s33 return loss of antenna port in receive band (1930.5 C 1989.5 mhz) db 9 9 16 9 s33 return loss of antenna port in transmit band (1850.5 C 1909.5 mhz) db 9 9 17 9 isolation transmit port to receive port s21 tx-rx isolation in receive band (1930.5 C 1989.5 mhz) db 44 44 51 44 s21 tx-rx isolation in transmit band (1850.5 C 1909.5 mhz) db 54 54 61 54 notes: t c is the case temperature and is defned as the temperature of the underside of the duplexer where it makes contact with the circuit board. min/max specifcations are guaranteed at the indicated temperature with the input power to the tx ports equal to or less than +29 dbm over all tx frequencies unless otherwise noted. typical data is the average value of the parameter over the indicated band at the specifed temperature. typical values may vary over time.
ACMD-7403 absolute maximum ratings [1] parameter unit value storage temperature c C65 to +125 maximum rf input power to tx port dbm +33 maximum recommended operating conditions [2] parameter unit value operating temperature, t c [3] , tx power 29 dbm c C40 to +100 operating temperature, t c [3] , tx power 30 dbm c C40 to +85 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. the device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifcations. 3. t c is defned as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board. characterization a test circuit similar to the one shown in figure 1 was used to measure typical device performance. this circuit is designed to interface with air coplanar (acp), ground- signal-ground (gsg) rf probes of the type commonly used to test semiconductor wafers.the pcb test circuit uses multiple vias to create a well-grounded pad to which the device under test (dut) is solder-attached. short lengths of 50-ohm microstripline connect the dut to acp probe patterns on the board. a test circuit with ACMD-7403 mounted in place is shown in figure 2. s-parameters are then measured using a network analyzer and calibrated acp probe set. phase data for s-parameters measured with acp probe circuits are adjusted to place the reference plane at the edge of the duplexer. figure 1. acp probe test circuit. figure 2. test circuit with duplexer.
-3 .0 -2 .0 -1 .0 0. 0 185 0 1 860 187 0 1 88 0 1 89 0 1 90 0 1 91 0 fr equen cy (m hz ) in se rt io n lo ss (d b) -3 .0 -2 .0 -1 .0 0. 0 fr equen cy (m hz ) in se rt io n lo ss (d b) -2 5 -2 0 -1 5 -1 0 -5 0 175 0 1 80 0 1 850 190 0 1 95 0 2 000 205 0 2 10 0 fr e q uenc y ( mh z ) re tu rn lo ss (d b ) -6 0 -5 0 -4 0 -3 0 -2 0 -1 0 0 fr equenc y (m hz ) in se rt io n lo ss (d b ) -8 0 -7 5 -7 0 -6 5 -6 0 -5 5 -5 0 -4 5 -4 0 -3 5 1750 1800 1850 190 0 1 95 0 2 00 0 2 050 210 0 fr equenc y (m hz ) in se rt ion lo ss (d b) -2 5 -2 0 -1 5 -1 0 -5 0 1750 1800 1850 1900 1950 2000 2050 2100 fr equen cy (m hz ) re tu rn lo ss (d b) 1930 1940 1950 1960 1970 1 980 1990 1750 1800 1850 1900 1950 2000 2050 2100 ACMD-7403 typical performance at t c = 25 c figure 3. t x Cant insertion loss figure 4. antCr x insertion loss figure 5. t x and r x port return loss figure 6. t x rejection in r x band and r x rejection in t x band figure 7. t x Cr x isolation figure 8. antenna port return loss
-6 0 -5 0 -4 0 -3 0 -2 0 -1 0 0 0. 0 1 .0 2. 0 3 .0 4. 0 5 .0 6. 0 fr equen cy (g hz ) in se rt io n lo ss (d b ) -2 0 -1 5 -1 0 -5 0 fr equenc y (m hz ) in s e rt io n lo s s (d b ) -6 0 -5 0 -4 0 -3 0 -2 0 -1 0 0 fr equenc y (g hz ) in se rt io n lo ss (d b) -6 0 -5 0 -4 0 -3 0 -2 0 -1 0 0 fr equen cy (g hz ) in se rt io n lo ss (d b) 3700 3720 3740 3760 3780 3800 3820 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 ACMD-7403 typical performance at t c = 25 c figure 9. t x Cant and antCr x wideband insertion loss figure 10. t x Cant rejection at t x second harmonic figure 11. t x Cant low frequency rejection figure 12. antCr x low frequency rejection
0. 2 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 -0 . 4 -0 . 6 -0 . 8 - 1 -1 . 5 - 2 - 3 - 4 - 5 -1 0 -2 0 -5 0 0. 2 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 -0 . 4 -0 . 6 -0 . 8 - 1 -1 . 5 - 2 - 3 - 4 - 5 -1 0 -2 0 -5 0 0. 2 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 -0 . 4 -0 . 6 -0 . 8 - 1 -1 . 5 - 2 - 3 - 4 - 5 -1 0 -2 0 -5 0 0. 2 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 0. 4 0. 6 0. 8 1 1. 5 2 3 4 5 1 0 2 0 5 0 -0 . 4 -0 . 6 -0 . 8 - 1 -1 . 5 - 2 - 3 - 4 - 5 -1 0 -2 0 -5 0 figure 13. t x port impedance in t x band figure 14. r x port impedance in r x band figure 15. ant port impedance in t x band figure 16. ant port impedance in r x band
figure 17. package outline drawing an t pa ckag e orient at io n tx rx h = acmd - 740 3 fb = av ag o id y = year ww = wo rk w eek dc = date code nnnn = lot nu mb er figure 18. product marking p a c k a g e o r i e n t a t i o n a n t t x r x p r o d u c t m a r k i n g t o p v i e w n o t e s : 1 . d i m e n s i o n s i n m i l l i m e t e r s t o l e r a n c e : x . x 0 . 1 m m x . x x 0 . 0 5 m m a n g l e s 4 5 , u n l e s s o t h e r w i s e n o t e d 2 . d i m e n s i o n s n o m i n a l u n l e s s o t h e r w i s e n o t e d 3 . i / o p a d s ( 3 e a ) s i z e : 0 . 3 5 x 0 . 3 5 m m s p a c i n g t o g r o u n d m e t a l : 0 . 3 0 m m 4 . s i g n a l v i a s ( 2 e a ) , ? 0 . 2 5 ; c o v e r e d w i t h 0 . 4 0 ? s o l d e r m a s k . s h o w n f o r r e f e r e n c e o n l y . p c b m e t a l u n d e r s i g n a l v i a d o e s n o t n e e d t o b e v o i d e d . 5 . c o n t a c t a r e a s a r e g o l d p l a t e d 3 . 0 m a x 1 . 2 m a x + 2 . 4 5 2 . 8 0 2 . 8 0 1 . 4 0 b o t t o m v i e w s i d e v i e w 3 . 0 m a x 2 . 4 5 0 . 6 1 0 . 0 5 0 . 4 3 0 . 3 3 0 . 2 5 s i g n a l v i a ( 2 p l s ) 0 . 3 5 0 . 3 5 d e t a i l o f i o p a d a r e a 0 . 3 0 0 . 3 0 0 . 2 5 0 . 2 5 0 . 0 5 0 . 0 5 0 . 0 7 5 0 . 0 7 5
notes: 1. dimensions in mm 2. transmission line gap (g) adjusted for zo = 50 ohms 3. i/o pads (3 ea) 0.35 x 0.35, corner chamfer 0.03 4. ground vias positioned to maximize port-to-port isolation 5. preferred tx connection on buried metal layer figure 19. pcb layout 2.10 2.28 g 0.35 ? 0. 30 vi a ar ra y ho ri z pi tc h = 0. 40 ve rt pi tc h = 0. 40 an t rx tx g 0.30 0.25 0.30 0.25 0.35 figure 20. ACMD-7403 superposed on pcb layout figure 21. recommended solder mask a pcb layout using the principles illustrated in figure 19 is recommended to optimize performance of the acmd- 7403. it is particularly important to maximize isolation between the tx connection to the duplexer and the rx port. high isolation is achieved by: (1) maintaining a continuous ground plane around the duplexer mounting area, (2) surrounding the i/o ports with sufcient ground vias to enclose the connections in a faraday cage, and (3) pref - erably routing the tx trace in a diferent metal layer than the rx. 2.90 2.90 > 0.30 ty p 0. 45 0. 45 0. 20 0. 20 > 0.30 ty p figure 22. ACMD-7403 superposed on solder mask the latter is especially useful, not only to maintain tx-rx isolation of the duplexer, but also to prevent leakage of the tx signal into other components that could result in the creation of intermodulation products and degrada - tion of overall system performance. a sufcient number of vias should be used to ensure excellent rf grounding as well as good heat sinking for the device. note: the two signal vias shown in fig 17 are covered with solder mask and it is not necessary to void the ground plane under them.
2.80 2.80 stenci l boundary 0.20 0.10 0.10 stencil opening id qty width (mm) length (mm) i/o pad areas 3 0.35 0.35 all other openings 9 0.50 0.50 notes: 1. chamfer or radius all corners 0.05 mm min 2. stencil openings aligned to boundary rectangle or center lines 3. non-i/o pad stencil openings aligned to 0.52 x 0.55 grid (i.e., spacing between openings: 0.2 vertical, 0.5 horizontal) figure 23. recommended solder stencil figure 24. solder stencil overlaid on ACMD-7403 bottom metal pattern figure 25. smd tape packing
10 figure 26. unit orientation in tape figure 27. reel drawing, front view
figure 28. reel drawing, back view package moisture sensitivity feature test method performance moisture sensitivity level (msl) at 260c jesd22-a113d level 3 figure 29. verifed smt solder profle 0 5 0 100 150 200 250 300 time, seconds 0 50 100 150 200 250 300 temperature, c tested profile shown . ordering information part number no. of devices container ACMD-7403-blk 25 anti-static bag ACMD-7403-tr1 1000 7-inch reel for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 00-00 avago technologies limited. all rights reserved. av0 -0 en - april 10, 00

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